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The University of Cincinnati's College of Design, Architecture, Art, and Planning is ranked among the very best in both a world and national class, year-after-year.

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Photo of Peter Chamberlain, MFA, MPHIL

Peter Chamberlain, MFA, MPHIL

Associate Professor - School of Design, Coordinator-Industrial Design, Associate Director

Education/Credentials

  • MFA: University of Cincinnati
  • MPhil-Design : Chiba University

Contact Information

Peer Reviewed Publications

Todd Timney, Peter Chamberlain 2017. Integrated Package Design: An interdisciplinary Approach to Package Design that Benefits Consumer Experience and Brand Perception Journal of Computer Aided Design and Applications, 14 1, 33

Peter Chamberlain 2014. Unboxing II (UBII): A Tool for Package Experience Analysis The International Journal of Designed Objects. , Volume 7 3,

Invited Presentations

Peter Chamberlain (03-23-2012) Opening Up Consumer Understanding for Package Design University of Cincinnati - Institute of Packaging Professionals chapter meeting, Cincinnati, Ohio

Peter Chamberlain, Todd Timney (06-15-2016) The Challenges and Perks of Interdisciplinary Packaging Design Education AIGA 'Nuts and Bolts' Design Educator's Conference, Bowling Green, Ohio

Peter Chamberlain (2009) New Values International Conference on Arts and Design 2009 - Institut Teknologi Bandung, Bandung, Indonesia

Peter Chamberlain (2009) Cultural Roots of Emotion and Perception nankin Technologic University (NTU) School of Arts and Media - Singapore, Singapore

Peter Chamberlain (2010) Where are you (coming) From? Purdue University, West Lafayatte, Indiana

Peter Chamberlain (2010) Transforum - discussing the future of public transportation in Cincinnati. TEDX , Cincinnati

Peter Chamberlain (2010) Perspectives on Industrial design and Engineering Education Proctor and Gamble "Gym", Cincinnati, Ohio

Peter Chamberlain (2011) Tapping Culture as Design Inspiration Singapore Polytechnic, Singapore

Peter Chamberlain (2011) Japanese Matsuri - Reflections of the past, links to the future Material Culture Conference - Material Culture Institute , Alberta, Canada

Peter Chamberlain (2011) Fit - Cultural Context in Design Hisense Corporation, Tsingtao, China

Peter Chamberlain (2012) Moving Ohio State University STIR Symposium Global Issues Conference, Columbus, Ohio

Peter Chamberlain, Sal Pellingra (2012) New Forms and Functions: Leveraging new technologies in materials and manufacturing to create new packaging media Packaging Digest Packaging Design 2012 Conference, Field Museum, Chicago, Illinois

Peter Chamberlain (2013) Unboxing II: A tool for front-end packaging experience analysis Design Principles and Practice Conference, Chiba, Japan

Peter Chamberlain (2013) Holistic Future Packaging Design (HFPD) Wuxi International Design Exposition , Wuxi, China

Peter Chamberlain, Todd Timney (2015) The Total Package: An Interdisciplinary Approach to Package Design That Benefits Consumer-Experience and Brand Perception. SEGD Academic Summit, Chicago

Poster Presentations

Peter Chamberlain, Aparna Sundar, Theodore Noseworthy (2013) Society of Consumer Psychology Conference, Honolulu, Hawaii